Qualcomm

Thermal Engineering Intern

May – Aug 2026

Worked across thermal hardware development, wafer-level characterization, DOE, RTD instrumentation, reduced-order thermal modeling, and physics-informed machine-learning models, building digital twins that connect experimental measurements with predictive engineering decisions.

This work involved confidential hardware and engineering processes, so I can’t share more than this. The project is presented at a high level, with proprietary geometry, detailed hardware information, and restricted performance data omitted.